On August 22, 2025, HCMUTE had the great honour of welcoming a delegation from the Taipei Economic and Cultural Office in Ho Chi Minh City for a dynamic and promising collaboration meeting.

The meeting opened with a proposal from Prof. Wei-Chih Lin, Education Counsellor, who emphasised three key areas of cooperation: Integrated Circuit (IC) Design, Semiconductor Education & Research, and the Fintech Mobility Program.

HCMUTE reaffirmed its strong commitment to expanding academic cooperation with Taiwan, particularly in these cutting-edge fields. Representatives from three faculties actively contributed their perspectives:

The Faculty of Electronics and Electrical Engineering (EEE) highlighted its ongoing IC Design and semiconductor-focused programmes, developed with expertise from Korean-trained lecturers. EEE expressed readiness to collaborate with Taiwanese universities, proposing to begin with IC Design, which requires less equipment, before moving on to Packaging.

The Faculty of Mechanical Engineering (FME) presented its Packaging-focused initiatives while also raising concerns about ensuring industry alignment and creating sustainable career opportunities for students.

The Faculty of International Education (FIE), in partnership with Chang Gung University (Taiwan), is developing programmes taught in Chinese at HCMUTE to strengthen students’ linguistic and professional competencies for study opportunities in Taiwan, China, and Hong Kong.

The meeting concluded with a lively Q&A session with students on TEEP programmes, doctoral study requirements, and language proficiency, followed by a warm networking lunch. This event marked an important step toward building a long-term and impactful partnership between HCMUTE and Taiwan in education, research, and innovation.